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Marking on IC package

Marking on IC package

Marking on IC packages

Crating high contrasting marks on IC packages becomes more difficult as the thickness of IC packages becomes thinner and thinner. High contrast marks without engraving is necessary to eliminate damage and the MDV series laser provides a clear advantage.

Benefit

High contrast marking without engraving. And a 300mm wide area helps reducing the need for product indexing and X-Y stages.

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  • MD-V9900A series - 3-Axis YVO4 Laser Marker

    For the first time in the industry, a laser marker has the capability to perform marking not only in the X and Y directions, but also the Z direction! The MD-V employs YVO4 as its laser crystalline media for stable high-aquality marking.

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