Asia Pacific

SJ-E Series Ultra High Speed Sensing Ioniser Hybrid Type Applications

The following are some of the many applications that are possible with our wide lineup of products.

Liquid crystal / Semiconductor industries

Static elimination when transferring liquid crystal glass

Static elimination when transferring liquid crystal glass

Target: Liquid crystal glass
Goal: Counter measures against foreign contamination

Static elimination during fork transferring of liquid crystal glass

Static elimination during fork transferring of liquid crystal glass

Target: Liquid crystal glass
Goal: Counter measures against foreign contamination

Static elimination when peeling protective film for wafers

Static elimination when peeling protective film for wafers

Target: Wafers
Goal: Counter measures against damage caused by electrostatic discharges and against foreign contamination

Static elimination during wafer inspection

Static elimination during wafer inspection

Target: Wafers
Goal: Counter measures against damage caused by electrostatic discharges and against foreign contamination

Electronic / Electric industries

Static elimination during electrode coating

Static elimination during electrode coating

Target: Electrodes
Goal: Counter measures against foreign contamination

Static elimination during binding

Static elimination during binding

Target: Touch panels
Goal: Counter measures against foreign contamination

Static elimination when transferring liquid crystal glass

Static elimination when transferring liquid crystal glass

Target: LEDs
Goal: Counter measures against transferring defects caused by clogging

Static elimination when transferring PCBs

Static elimination when transferring PCBs

Target: PCBs
Goal: Counter measures against damage caused by electrostatic discharges and against foreign contamination

Static elimination of reel winders prior to mounting

Static elimination of reel winders prior to mounting

Target: Chip components
Goal: Prevention of transferring defects caused by adhesion and damage caused by electrostatic discharges for chips

Static elimination of winding machine sheets

Static elimination of winding machine sheets

Target: Electrodes of lithium ion batteries and separators
Goal: Prevention of sheet offsetting during winding

Static elimination of green sheets prior to lamination

Static elimination of green sheets prior to lamination

Target: Green sheets
Goal: Counter measures against foreign contamination

Static elimination during optical fibre winding

Static elimination during optical fibre winding

Target: Optical fibre
Goal: Counter measures against transferring defects

Transferring industry

Static elimination prior to vehicle frame painting

Static elimination prior to vehicle frame painting

Target: Vehicle frames
Goal: Counter measures against foreign contamination

Static elimination when transferring bumpers

Static elimination when transferring bumpers

Target: Bumpers
Goal: Counter measures against foreign contamination

Static elimination when transferring front panels

Static elimination when transferring front panels

Target: Front panels
Goal: Counter measures against foreign contamination

Static elimination during metre panel assembly

Static elimination during metre panel assembly

Target: Metre panels
Goal: Counter measures against damage caused by electrostatic discharges and against foreign contamination

Resin / Film industries

Static elimination when transferring film

Static elimination when transferring film

Target: Film
Goal: Counter measures against foreign contamination and against discharges to the human body

Static elimination during separator slitting

Static elimination during separator slitting

Target: Separators
Goal: Counter measures against foreign contamination

Static elimination of entire moulds

Static elimination of entire moulds

Target: Mould
Goal: Counter measures against products adhering to moulds

Static elimination of preformed parts

Static elimination of preformed parts

Target: Preformed parts
Goal: Counter measures against foreign contamination

Food / Medicine industries

Static elimination when transferring instant noodles

Static elimination when transferring instant noodles

Target: Cups and ingredients
Goal: Counter measures against cup sealing defects and against ingredients sticking to cups

Static elimination during horizontal form-fill-seal packaging

Static elimination during horizontal form-fill-seal packaging

Target: Food
Goal: Counter measures against the adherence of foreign contaminants

Static elimination during blister packaging

Static elimination during blister packaging

Target: Medicine
Goal: Counter measures against pills jumping out and against foreign contamination

Static elimination during air showers

Static elimination during air showers

Target: Humans
Goal: Counter measures against people bringing in foreign contaminants