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VHX-600 54 million-pixel 3CCD digital microscope
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Applications

Electric & Electronics Industries

Unbeatable Performance in Automation and Sensing Applications.

For Full Details Download the PRODUCT CATALOG Using the SERVICE PULLDOWN Above.
BGA solder defects
BGA solder defects
Smooth observation every step of the way from the initial search for an observation point to magnified analysis. Magnification can also be set according to an appropriate field of view.
Observation of whiskers
Observation of whiskers
High-resolution lens with numerical aperture of 0.82 and maximum magnification of 5000x enables clear observation of fine whiskers. Unlike an SEM, the VHX-600 does not require a vacuum system, which eliminates the risk of whiskers breaking off and scattering.
Observation of wire bonding
Observation of wire bonding
Depth composition images can be captured even with the lens set at an angle. This feature makes it possible to compare how well adjacent wires have bonded.
ITO film
ITO film
Using a 10x zoom lens allows a wide field of view to be searched at high-resolution in order to locate observation points as well as enabling more detailed analysis.
PWB solder
PWB solder
High dynamic range function reduces diffuse reflections and glare to enable clear observation.
Light guide plate
Combining transmission lighting with the light shift function emphasizes outlines for clear observation, even allowing observation of transparent targets such as this foreign matter on a light guide plate.
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